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Q.Write two points of difference between intrinsic and extrinsic semiconductors.

CBSECBSE Class XII Board 2026Subjective· 2mImportance★★★★★
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The key difference is that intrinsic semiconductors are pure (no added impurities), while extrinsic semiconductors are doped with impurities to control conductivity. Intrinsic has equal electron and hole concentrations; extrinsic has one type of carrier dominating.

The Concept First

Semiconductors conduct electricity, but not as well as metals. Their conductivity depends on how many free electrons and holes (missing electrons) are available to carry charge. In a pure semiconductor, every electron that jumps to the conduction band leaves a hole behind — so the number of electrons (nn) equals the number of holes (pp). This is an intrinsic semiconductor.

But we often need a material that conducts better, or that conducts mostly via one type of carrier. So we deliberately add a tiny amount of impurity — a process called doping. The result is an extrinsic semiconductor, where one carrier type dominates.

The two points of difference below capture the essence of this contrast.


Two Points of Difference

  1. Purity and Doping

    An intrinsic semiconductor is chemically pure — no foreign atoms are added. Its conductivity comes entirely from thermally generated electron-hole pairs.

    An extrinsic semiconductor has a controlled amount of impurity atoms (dopants) added. For example, adding phosphorus (a pentavalent atom) to silicon gives extra electrons, making it n-type. Adding boron (trivalent) creates extra holes, making it p-type.

  2. Carrier Concentration

    In an intrinsic semiconductor, the number of free electrons equals the number of holes: ni=pin_i = p_i. This concentration depends only on temperature and the material's band gap.

    In an extrinsic semiconductor, one carrier type vastly outnumbers the other. For an n-type semiconductor, n≫pn \gg p; for p-type, p≫np \gg n. The majority carrier concentration is roughly equal to the dopant concentration, which can be controlled during fabrication. …

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