Q.(a) Why is an intrinsic semiconductor deliberately converted into an extrinsic semiconductor by adding impurity atoms ?
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Start your 14-day free trial to unlock the full solution →Doping transforms an intrinsic semiconductor into an extrinsic one to dramatically increase conductivity at room temperature by providing abundant charge carriers. The p-n junction barrier forms through diffusion of majority carriers across the junction followed by drift that establishes equilibrium, creating a depletion region with a built-in potential.
(a) The Need for Doping: From Intrinsic to Extrinsic
An intrinsic semiconductor in its pure form is a poor conductor at room temperature. Silicon, for instance, has a band gap of about , which means thermal energy at (roughly ) can excite only a tiny fraction of electrons from the valence band to the conduction band. The intrinsic carrier concentration for silicon at room temperature is approximately —far too low for practical electronic devices.
When we deliberately introduce impurity atoms (doping), we create an extrinsic semiconductor with a controlled, vastly higher carrier concentration. A typical doping level of to increases conductivity by five to eight orders of magnitude. This happens because:
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n-type doping (Group V elements like phosphorus, arsenic) donates extra electrons to the conduction band without requiring thermal excitation across the full band gap. The donor energy level sits just below the conduction band (), so electrons are easily ionized at room temperature.
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p-type doping (Group III elements like boron, gallium) creates holes in the valence band by accepting electrons. The acceptor level lies just above the valence band, making hole creation equally efficient.
The key advantage: we gain controllable, predictable conductivity that is nearly temperature-independent over a useful range, and we can engineer devices by creating regions of different doping types.
The conductivity of an extrinsic semiconductor is given by , where the majority carrier concentration dominates. Doping lets us tune by design rather than relying on unpredictable thermal generation.
(b) Formation of the Potential Barrier at a p-n Junction
When p-type and n-type regions are brought into contact (or created adjacently in a single crystal), two competing processes establish equilibrium and create the depletion region with its characteristic potential barrier.
1. Diffusion Process
Immediately after junction formation, a steep concentration gradient exists: the n-side has a high concentration of free electrons () while the p-side has very few; conversely, the p-side is rich in holes.
Diffusion—the natural tendency of particles to move from high to low concentration—drives:
- Electrons from the n-region across the junction into the p-region
- Holes from the p-region across the junction into the n-region
As electrons leave the n-side, they leave behind positively charged donor ions (, , etc.) that are fixed in the crystal lattice and cannot move. Similarly, as holes leave the p-side, negatively charged acceptor ions (, , etc.) remain. These immobile ions create a space-charge region or depletion region near the junction—depleted of mobile carriers but containing fixed charges.
The exposed positive charge on the n-side and negative charge on the p-side create an electric field pointing from n to p, and an associated potential difference (the built-in potential or barrier potential).
where and are acceptor and donor concentrations, is the intrinsic carrier concentration, is Boltzmann's constant, is temperature, and is electron charge.
2. Drift Process
The electric field in the depletion region exerts a force on any mobile charge carriers:
- Electrons in the depletion region experience a force toward the n-side (opposite to )
- Holes experience a force toward the p-side (along ) …
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